GPI Solutions

Thermoformed Glass Projects (TSM)

• We develop and deliver integrated solutions for projects
  involving Thermal Sheet Molding of glass (TSM).

MEMS

Micro-Electro-Mechanical Systems

• TSM-structured glass wafer for 0-level packaging
  (wafer level packaging) of MEMS sensors.
• Customer specific shapes and structures
• Up to 8“ in diameter
• Structure sizes as small as 80 µm
• Smallest tolerances available
• Applicable for most common glass types

Automotive

Complex glass shapes -
manufactured with TSM technology

• Automotive parts
• Components for the production of OEMs

Medical

Technical medical equipment -
manufactured with TSM technology

• Casings and components for technical medical equipment
• Protective glass layers for medical sensors
• Complex shapes
• Tight tolerances

Display

Organic Light Emitting Diode (OLED)

• Hermetic glass encapsulations of OLEDs
• Transparent
• Complex shapes
• High solidity

Electronics

New product designs with TSM

More

...did not find what you were looking for?

• Please do not hesitate to contact us –
  we are confident that we will find a design to suit your requirements.
• e-mail
• phone